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Industry
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Malaysia seeks over $107B in chip investment
Malaysia is aiming to increase its role in the global semiconductor supply chain and is targeting more than $107 billion in investments in advanced packaging, manufacturing equipment and integrated circuit design, according to Prime Minister Anwar Ibrahim. Malaysia expects to contribute $5.3 billion to meet the targets.
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HBM Prices to Jump 5–10% in 2025
HBM’s share of total DRAM bit capacity is estimated to rise from 2% in 2023 to 5% in 2024 and surpass 10% by 2025. In terms of market value, HBM is projected to account for more than 20% of the total DRAM market value starting in 2024, potentially exceeding 30% by 2025.
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Toshiba Completes 300mm Wafer Fab Facility for Power Chips
The completion of construction is a major milestone for Phase 1 of Toshiba’s multi-year investment program. Toshiba will now proceed with equipment installation, toward starting mass production in the second half of fiscal year 2024.
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TSMC Launches Program to Enhance Green Conservation
Moving forward on its commitment to protecting biodiversity, Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) has launched the “Eco Plus! – Ecological Harmony Program”, which integrates internal and external resources to connect fragmented biological habitats, enhance species survival, and establish a reward system to support potential talents and important ecological research on biodiversity.
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